Manufacturing Process 制造工艺

HICHIP has accumulated certain resource advantages and processing experience, and has integrated strategic partners such as core technology designers, packaging and testing manufacturers. Product lines include USB, SSD, etc. Support high-stack packaging, high packaging and testing yield, and moderate cost. 海芯科技积累了一定的资源优势与加工经验,整合了核心技术设计、封装测试等战略合作伙伴。产品线涵盖USB、SSD等。支持高堆叠封装、高封装测试良率,成本适中。

High Performance 高性能
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High security 高安全性
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Flexible expansion 灵活扩展
USB Product USB Product
SSD Product SSD Product

Manufacturing Process 制造工艺

Inked Wafer 晶圆标记
Inked die Transfer 芯片转移
Die Sorting 芯片分选
Packaging 封装
Flash to F/W 固件烧录
P/N Marking 标记
SMT 表面贴装
Flash Card Tester 闪存卡测试
Module 模组
Manufacturing Process

Inked Wafer 晶圆标记

Measured Data 测量数据

128GB SSD

128GB SSD

256GB SSD

256GB SSD