Manufacturing Process 制造工艺
HICHIP has accumulated certain resource advantages and processing experience, and has integrated strategic partners such as core technology designers, packaging and testing manufacturers. Product lines include USB, SSD, etc. Support high-stack packaging, high packaging and testing yield, and moderate cost. 海芯科技积累了一定的资源优势与加工经验,整合了核心技术设计、封装测试等战略合作伙伴。产品线涵盖USB、SSD等。支持高堆叠封装、高封装测试良率,成本适中。
High Performance
高性能
High security
高安全性
Flexible expansion
灵活扩展
Manufacturing Process 制造工艺
Inked Wafer
晶圆标记
Inked die Transfer
芯片转移
Die Sorting
芯片分选
Packaging
封装
Flash to F/W
固件烧录
P/N Marking
标记
SMT
表面贴装
Flash Card Tester
闪存卡测试
Module
模组
Inked Wafer 晶圆标记
Measured Data 测量数据
128GB SSD
256GB SSD