NAND Flash & Packaging Technology NAND闪存与封装技术
HICHIP's expertise spans NAND technology understanding, advanced IC packaging, firmware development, and storage module manufacturing. We bridge the gap between raw NAND wafers and market-ready products. 海芯的专业知识涵盖NAND技术理解、先进IC封装、固件开发和存储模组制造。我们架起了NAND晶圆与市场就绪产品之间的桥梁。
NAND Cell Technology Evolution NAND单元技术演进
From SLC to QLC — each generation trades endurance for density. We select the right NAND for every use case. 从SLC到QLC — 每一代都在耐久性和密度之间权衡。我们为每个用例选择最合适的NAND。
Single-Level Cell
Multi-Level Cell
Triple-Level Cell
Quad-Level Cell
3D NAND Layer Evolution 3D NAND层堆叠演进
Vertical stacking revolutionized NAND density. Solidigm leads with 192-layer floating gate QLC technology. 垂直堆叠彻底改变了NAND密度。Solidigm以192层浮栅QLC技术领先。
IC Packaging & Testing IC封装与测试
This is what HICHIP does. Our packaging lines transform NAND dies into reliable, market-ready storage modules. 这是海芯的核心业务。我们的封装产线将NAND芯片转化为可靠的、市场就绪的存储模组。
Wire Bonding 引线键合
Gold or copper wire interconnects between die and substrate. Cost-effective for medium-pin-count packages. 金线或铜线连接芯片与基板。对于中等引脚数封装具有成本效益。
Flip Chip 倒装焊
Direct die-to-substrate connection with solder bumps. Higher I/O density and better electrical performance. 焊球直接连接芯片与基板。更高的I/O密度和更好的电气性能。
Test & Quality 测试与质量
100% burn-in testing, functional verification, and environmental stress screening for every module. 每个模组100%老化测试、功能验证和环境应力筛选。
Note: HICHIP does NOT manufacture NAND wafers. We source NAND wafers from global suppliers (Samsung, SK hynix, Solidigm) and apply our packaging, firmware, and testing expertise to produce finished storage modules. 说明：海芯利华不制造NAND晶圆。我们从全球供应商（三星、SK海力士、Solidigm）采购NAND晶圆，并应用我们的封装、固件和测试专业知识来生产成品存储模组。
Storage Module Manufacturing Flow 存储模组制造流程
From NAND wafer to finished module — the HICHIP production pipeline. 从NAND晶圆到成品模组——海芯的生产管线。
Wafer Sourcing 晶圆采购
Procure from Samsung, SK hynix, Solidigm 从三星、SK海力士、Solidigm采购
Die Sorting 芯片分选
KGD test and binning 已知良品芯片测试与分档
IC Packaging IC封装
Wire bonding / Flip chip 引线键合/倒装焊
PCB Assembly PCB组装
SMT placement and reflow 贴片与回流焊
Firmware 固件烧录
Flash controller firmware 闪存控制器固件
Testing 测试
Burn-in and final QC 老化与最终质检
Packaging 包装出货
Anti-static packaging 防静电包装