NAND Flash & Packaging Technology NAND闪存与封装技术
HICHIP's expertise spans NAND technology, advanced IC packaging, firmware development, and storage module manufacturing. We bridge raw NAND wafers and market-ready products. 海芯的专业知识涵盖NAND技术、先进IC封装、固件开发和存储模组制造。我们连接NAND晶圆与市场就绪产品。
NAND Cell Technology NAND单元技术
From SLC to QLC — each generation trades endurance for density. 从SLC到QLC — 每一代都在耐久性和密度之间权衡。
NAND flash stores data by trapping electrical charge in floating gates. SLC stores 1 bit per cell with 100K+ program/erase cycles. Each generation — MLC (2-bit), TLC (3-bit), QLC (4-bit) — increases density but reduces endurance. We select the right NAND type for every application. NAND闪存通过在浮栅中捕获电荷来存储数据。SLC每单元存储1位，具有10万+次编程/擦除周期。每一代——MLC（2位）、TLC（3位）、QLC（4位）——都增加了密度但降低了耐久性。我们为每个应用选择最合适的NAND类型。
Single-Level Cell
Multi-Level Cell
Triple-Level Cell
Quad-Level Cell
3D NAND Layer Stack 3D NAND层堆叠
Vertical stacking replaced planar NAND. Solidigm leads with 192-layer floating gate QLC. 垂直堆叠取代了平面NAND。Solidigm以192层浮栅QLC领先。
Instead of shrinking cells horizontally (which hit physical limits below 15nm), 3D NAND stacks cells vertically. Each "layer" adds capacity without reducing reliability. Today's leading-edge products stack 192+ layers, with 300+ layers on the roadmap. 3D NAND不再水平缩小单元（这在15nm以下遇到了物理极限），而是垂直堆叠单元。每一"层"都在不降低可靠性的情况下增加容量。今天的领先产品堆叠192+层，路线图上有300+层。
HICHIP sources 3D NAND wafers from Samsung (V-NAND), SK hynix, and Solidigm, then packages them into finished storage modules through our wire bonding and flip chip lines. 海芯从三星（V-NAND）、SK海力士和Solidigm采购3D NAND晶圆，然后通过我们的引线键合和倒装焊产线将其封装成成品存储模组。
IC Packaging & Testing IC封装与测试
This is what HICHIP does. Our lines transform NAND dies into market-ready modules. 这是海芯的核心业务。我们的产线将NAND芯片转化为市场就绪的模组。
Wire Bonding 引线键合
Gold or copper wire interconnects between die and substrate. Cost-effective for medium-pin-count packages like BGA and TSOP. 金线或铜线连接芯片与基板。对于BGA和TSOP等中等引脚数封装具有成本效益。
Flip Chip 倒装焊
Solder bump direct die-to-substrate connection. Higher I/O density and better electrical performance for advanced packages. 焊球直接芯片对基板连接。更高的I/O密度和更好的电气性能，适用于先进封装。
Test & Quality 测试与质量
100% burn-in at 125°C, functional pattern testing, and temperature cycling for every module before shipment. 每个模组出货前100% 125°C老化测试、功能图形测试和温度循环测试。
Note: HICHIP does NOT manufacture NAND wafers. We source NAND wafers from global suppliers (Samsung, SK hynix, Solidigm) and apply our packaging, firmware, and testing expertise to produce finished storage modules. 说明：海芯利华不制造NAND晶圆。我们从全球供应商（三星、SK海力士、Solidigm）采购NAND晶圆，并应用我们的封装、固件和测试专业知识来生产成品存储模组。
Manufacturing Flow 制造流程
From NAND wafer to finished module. 从NAND晶圆到成品模组。
Wafer晶圆采购
Samsung, SK hynix, Solidigm三星、SK海力士、Solidigm
Die Sort芯片分选
KGD test & binning良品测试与分档
PackageIC封装
Wire bond / Flip chip引线键合/倒装焊
SMTSMT贴片
PCB placement & reflowPCB贴片与回流焊
Firmware固件烧录
Controller firmware控制器固件
Test测试
Burn-in & final QC老化与质检
Ship包装出货
Anti-static pack防静电包装