NAND Storage & AI Infrastructure NAND存储与AI基础设施

Storage Modules.
AI Infrastructure. 存储模组制造
AI基础设施集成

NAND wafer sourcing, IC packaging, and consumer-grade storage module production. Plus Neo Cloud AIDC integration — GPU clusters and high-speed storage for the AI era.

NAND晶圆采购、IC封装、消费级存储模组制造。以及智算云AIDC集成 — GPU集群与高速存储，赋能AI时代。

Products 产品 Neo Cloud 智算云

14+

Years in Storage 年存储行业经验

PCIe 5.0

Enterprise SSD 企业级SSD

192L

3D NAND 3D NAND

AIDC

AI Data Center AI数据中心

What We Do

Two Strategic Pillars 两大战略支柱

From consumer devices to AI data centers. 从消费设备到AI数据中心。

Pillar 1

Consumer Storage Modules 消费级存储模组

NAND wafer sourcing, IC packaging, firmware development, and manufacturing of USB drives, SSDs, eMMC, UFS, and ePOP. NAND晶圆采购、IC封装、固件开发，以及USB闪存盘、SSD、eMMC、UFS、ePOP制造。

Wire Bonding Flip Chip BGA USB / M.2 / SATA

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Pillar 2

Neo Cloud AIDC 智算云AIDC

Turnkey AI data center solutions. GPU clusters, Solidigm D7-PS1010 PCIe 5.0 SSDs, and ultra-low-latency networking for LLM training. 交钥匙AI数据中心方案。GPU集群、Solidigm D7-PS1010 PCIe 5.0 SSD、超低延迟网络，专为LLM训练设计。

GPU Clusters PCIe 5.0 SSD LLM Training Turnkey AIDC

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Products

Storage Portfolio 存储产品矩阵

Enterprise SSD 企业级SSD

PCIe 5.0 NVMe for data centers. Up to 14 GB/s, 61.44TB. 数据中心级PCIe 5.0 NVMe。最高14GB/s，61.44TB。

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Consumer Storage 消费级存储

USB drives, portable SSDs, memory cards. USB闪存盘、移动固态硬盘、存储卡。

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Embedded Storage 嵌入式存储

eMMC, UFS, ePOP for mobile, automotive, IoT. eMMC、UFS、ePOP，面向智能手机、汽车、物联网。

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NAND Components NAND组件

Wafers and KGD from Samsung, SK hynix, Solidigm. 来自三星、SK海力士、Solidigm的晶圆和KGD。

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Manufacturing

Packaging & Testing 封装与测试

Our core competency is IC packaging and testing — the critical bridge between raw NAND wafers and finished storage modules. 我们的核心竞争力在于IC封装与测试——这是连接NAND晶圆与成品存储模组的关键环节。

We source NAND wafers from global suppliers and transform them into reliable products through packaging, firmware, and quality control. 我们从全球供应商采购NAND晶圆，通过封装、固件和质量控制流程将其转化为可靠产品。