HICHIP Corp. 海芯利华科技
HICHIP Corp. (Haixin Lihua Technology) operates two strategic business pillars: consumer-grade NAND storage module manufacturing and Neo Cloud AIDC infrastructure integration. Headquartered in Hong Kong with operations in Beijing, we serve global markets with precision and reliability. 海芯利华科技有限公司运营两大战略业务支柱：消费级NAND存储模组制造和智算云AIDC基础设施集成。总部设于香港，在北京设有运营中心，我们以精准和可靠服务全球市场。
Company Advantages 公司优势
IC Packaging Expertise IC封装专业能力
Wire bonding, flip chip, and BGA packaging lines. We transform raw NAND dies into reliable storage modules. 引线键合、倒装焊和BGA封装产线。我们将NAND芯片转化为可靠的存储模组。
Global Supply Network 全球供应网络
Direct partnerships with Samsung, SK hynix, Solidigm ensure supply chain resilience and competitiveness. 与三星、SK海力士、Solidigm的直接合作确保供应链韧性和竞争力。
AI Infrastructure Integration AI基础设施集成
Neo Cloud AIDC turnkey solutions — GPU clusters, PCIe 5.0 storage, and ultra-low-latency networking. 智算云AIDC交钥匙方案 — GPU集群、PCIe 5.0存储和超低延迟网络。
Full Product Portfolio 全产品矩阵
From USB drives to enterprise PCIe 5.0 NVMe and embedded eMMC/UFS — one partner for all storage needs. 从USB闪存盘到企业级PCIe 5.0 NVMe和嵌入式eMMC/UFS — 一个合作伙伴满足所有存储需求。
Vision & Culture 愿景与文化
Powering the data economy with reliable storage and AI infrastructure. 以可靠的存储和AI基础设施驱动数据经济。
Continuous innovation in packaging technology and AI data center design. 在封装技术和AI数据中心设计方面持续创新。
Zero-defect quality culture with 100% burn-in and functional testing. 零缺陷质量文化，100%老化和功能测试。
Long-term partnerships built on trust, transparency, and shared success. 基于信任、透明和共同成功的长期合作伙伴关系。
Get in Touch 联系我们
HICHIP Corp. (Haixin Lihua Technology Co., Ltd.) 海芯利华科技有限公司
For product inquiries, partnership proposals, and AIDC integration projects. 有关产品咨询、合作提案和AIDC集成项目。