NAND Flash Components NAND闪存组件
HICHIP sources NAND wafers and known good dies (KGD) from the world's leading suppliers, providing reliable raw materials for our storage module manufacturing. 海芯利华从世界领先供应商采购NAND晶圆和已知良品芯片（KGD），为我们的存储模组制造提供可靠的原材料。
Global NAND Suppliers 全球NAND供应商
Strategic partnerships with industry leaders ensure supply chain resilience and technology access. 与行业领导者的战略合作确保供应链韧性和技术获取。
Solidigm
Former Intel NAND division. Leader in QLC enterprise SSDs with 192-layer floating gate technology. 原英特尔NAND业务。以192层浮栅技术领先QLC企业级SSD。
SK hynix
World's second-largest memory manufacturer. 238-layer TLC NAND and HBM3E technology leader. 全球第二大内存制造商。238层TLC NAND和HBM3E技术领导者。
Samsung
V-NAND vertical stacking pioneer. 236-layer V9 NAND with leading bit density and performance. V-NAND垂直堆叠先驱。236层V9 NAND，位密度和性能行业领先。
Solidigm NAND Flash Chips Solidigm NAND闪存芯片
Advanced QLC NAND for client and consumer SSD applications. 先进QLC NAND，面向客户端和消费级SSD应用。
N4PA & N38E QLC NAND N4PA与N38E QLC NAND
Both N4PA and N38E are Solidigm's advanced QLC NAND products for the consumer and client SSD market. Built on 144-192 layer architectures, they deliver high density and cost-effective storage for everyday computing, gaming, and content creation workloads. N4PA和N38E都是Solidigm面向消费级和客户端SSD市场的先进QLC NAND产品。基于144-192层架构，为日常计算、游戏和内容创作工作负载提供高密度和经济高效的存储。
N4PA (pQLC)
Next-generation 5-bits-per-cell NAND. 192-layer floating gate architecture with 1600 MT/s interface speed for high-density consumer storage applications. 下一代每单元5位NAND。192层浮栅架构，1600 MT/s接口速度，面向高密度消费级存储应用。
N38E (QLC)
Replacement gate QLC NAND for client SSDs. 144-192 layer architecture with balanced performance and cost for consumer storage applications. 替代栅QLC NAND，面向客户端SSD。144-192层架构，为消费级存储应用提供均衡的性能和成本。
NAND Die Capacity Options NAND芯片容量选项
Available in wafer, known good die (KGD), and packaged form factors. Contact us for custom configurations. 提供晶圆、已知良品芯片（KGD）和封装形式。联系我们获取定制配置。
NAND & Manufacturing NAND与制造
