NAND Flash Components NAND闪存组件
HICHIP sources NAND wafers and chips from the world's leading suppliers, providing reliable raw materials for our storage module manufacturing. 海芯利华从世界领先供应商采购NAND晶圆和芯片，为我们的存储模组制造提供可靠的原材料。
Global NAND Suppliers 全球NAND供应商
Strategic partnerships with industry leaders ensure supply chain resilience and technology access. 与行业领导者的战略合作确保供应链韧性和技术获取。
Solidigm
Intel NAND division spun off to SK hynix. Leader in QLC enterprise SSDs with 192-layer floating gate technology. 英特尔NAND业务分拆至SK海力士。以192层浮栅技术领先QLC企业级SSD。
SK hynix
World's second-largest memory manufacturer. Leading 238-layer TLC NAND and HBM3E memory technology. 全球第二大内存制造商。领先的238层TLC NAND和HBM3E内存技术。
Samsung
Pioneer in V-NAND vertical stacking. 236-layer V9 NAND with industry-leading bit density and performance. V-NAND垂直堆叠先驱。236层V9 NAND，位密度和性能行业领先。
Solidigm NAND Flash Chips Solidigm NAND闪存芯片
Advanced floating gate QLC NAND — the core technology powering Solidigm's industry-leading enterprise SSDs. 先进浮栅QLC NAND — 驱动Solidigm行业领先企业级SSD的核心技术。
N4PA (pQLC)
Next-generation 5-bits-per-cell NAND technology. 192-layer floating gate architecture with 1600 MT/s interface speed, delivering unprecedented density for data center applications. 下一代每单元5位NAND技术。192层浮栅架构，1600 MT/s接口速度，为数据中心应用提供前所未有的密度。
N38E (QLC)
High-performance QLC NAND with replacement gate architecture. Supports both client and data center SSD applications with balanced performance and endurance. 采用替代栅架构的高性能QLC NAND。支持客户端和数据中心SSD应用，性能与耐久性平衡。
NAND Die Capacity Options NAND芯片容量选项
Available in wafer, known good die (KGD), and packaged form factors. Contact us for custom configurations. 提供晶圆、已知良品芯片（KGD）和封装形式。联系我们获取定制配置。